The IETE SVC Aiya Memorial Award Lecture " 2026 2006–2026: Two Decades of Innovation in Metamaterials, Metasurfaces, and Wireless Power Transfer — Shaping the Future of Electromagnetic Technologies"
Prof. Chinmoy Saha, Professor, Department of Avionics, Indian Institute of Space Science and Technology (IIST), Thiruvananthapuram, has been conferred with the prestigious IETE–Prof. SVC Aiya Memorial Award 2026 by the Institution of Electronics and Telecommunication Engineers (IETE). The award was presented during the 69th Annual IETE Convention (AIC–2026), held in Kolkata on 25–26 September 2026, with the theme “Network Security and Blockchain Technology.” According to the award communication from IETE, Prof. Saha was selected in recognition of his outstanding contributions and dedicated guidance in Electronics and Telecommunication research.The citation accompanying the award recognizes his “outstanding contributions to Radio Science and Telecommunication Engineering through innovative research, technological advancements, and practical applications.” The award comprises a medal, cash prize and citation, and Prof. Saha is also invited to deliver a lecture on the work associated with the award at an IETE Centre. Prof. Saha’s research spans microwave and antenna engineering, wireless power transfer and microwave energy harvesting, metamaterials and metasurfaces, multifunctional and reconfigurable antennas, mIcrowave circuits, and electromagnetic technologies for space and emerging wireless applications. The recognition highlights his sustained contributions to advanced research and technology development in electronics, telecommunications, and applied electromagnetics. The talk highlighted the translation of theoretical concepts into experimentally validated prototypes and practical systems, demonstrating how metamaterials and metasurfaces have evolved from scientific curiosities into enabling technologies for next-generation communication, sensing, and energy applications. Finally, future research directions involving intelligent metasurfaces, integrated wireless power and communication systems, and sub-THz platforms for 6G applications will be outlined.
